IEE 5011 FALL 2013 Memory Systems LPDDR 3
LPDDR4 - everything you need to know
Using Multi-Channel Connections for Optimized LPDDR4 Power & Performance
Samsung Introduces 8 GB LPDDR4-4266 Package for Mobile Devices
Design considerations for LPDDR4/3 PHY and controller sub system
Power efficiency for LPDDR with POP structure. | Download Scientific Diagram
Synopsys silicon IP for LPDDR4 memory
Package Options
SK Hynix Announces 8 GB LPDDR4X-4266 DRAM Packages
Micron Technology Low Power DDR4 (LPDDR4) | EBV Elektronik
Micron's Memory solutions for the latest i.MX 8M Family
SK Hynix Announces 8 GB LPDDR4X-4266 DRAM Packages
Next-Generation DDR4 and LPDDR4 IP in TSMC 16FF+ Enable 200Gb+ Data Transfers for Mobile, Cloud, and IoT Platforms - Tensilica and Design IP - Cadence Blogs - Cadence Community
Signal and power integrity limitations for mobile memory in 3D packaging (Part 1 of 2) - EDN
Architectural Options for LPDDR4 Implementation in Your Next Chip Design
An Exclusive Look Inside Samsung's Memory Exhibit at MWC – Samsung Global Newsroom
SK Hynix Announces 8 GB LPDDR4X-4266 DRAM Packages
Validation of LPDDR2/3 Package on Package (PoP) Memory Channels
Table 1 from A Novel System-in-Package using High-Density Fan-out Technology for Heterogeneous Integration | Semantic Scholar
LPDDR - Wikipedia
LPDDR4 | Interface IP | DesignWare IP | Synopsys
Package on a package - Wikipedia
